M. Asheghi: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

Enhanced Heat Transfer Using Microporous Copper Inverse Opals

Lee, Hyoungsoon, Maitra, Tanmoy, Palko, James, Kong, Daeyoung, Zhang, Chi, Barako, Michael T., Won, Yoonjin, Asheghi, Mehdi, Goodson, Kenneth E.

Journal:

Journal of Electronic Packaging

Year:

2018

Language:

english

File:

PDF, 1.23 MB

english, 2018

2

Free convection heat transfer from arrays of vertically separated horizontal cylinders at low Rayleigh numbers

M.Sadegh Sadeghipour, M. Asheghi

Journal:

International Journal of Heat and Mass Transfer

Year:

1994

Language:

english

File:

PDF, 823 KB

english, 1994

3

Thermal conduction in doped single-crystal silicon films

Asheghi, M., Kurabayashi, K., Kasnavi, R., Goodson, K. E.

Journal:

Journal of Applied Physics

Year:

2002

Language:

english

File:

PDF, 615 KB

english, 2002

4

Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics

Won, Yoonjin, Cho, Jungwan, Agonafer, Damena, Asheghi, Mehdi, Goodson, Kenneth E.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 2.55 MB

english, 2015

5

Energy-Efficient Abundant-Data Computing: The N3XT 1,000x

Sabry Aly, Mohamed M., Gao, Mingyu, Hills, Gage, Lee, Chi-Shuen, Pitner, Greg, Shulaker, Max M., Wu, Tony F., Asheghi, Mehdi, Bokor, Jeff, Franchetti, Franz, Goodson, Kenneth E., Kozyrakis, Christos,

Journal:

Year:

2015

Language:

english

File:

PDF, 4.27 MB

english, 2015

6

Crowdsourcing for web genre annotation

Asheghi, Noushin Rezapour, Sharoff, Serge, Markert, Katja

Journal:

Language Resources and Evaluation

Year:

2016

Language:

english

File:

PDF, 1.00 MB

english, 2016

7

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Heat Transfer Enhancement in the Heat Sinks for Electronic Cooling Applications

Small, Evan, Sadeghipour, Sadegh M., Asheghi, Mehdi

Year:

2005

Language:

english

File:

PDF, 431 KB

english, 2005

8

Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance

Jung, Ki Wook, Kharangate, Chirag R., Lee, Hyoungsoon, Palko, James, Zhou, Feng, Asheghi, Mehdi, Dede, Ercan M., Goodson, Kenneth E.

Journal:

International Journal of Heat and Mass Transfer

Year:

2019

Language:

english

File:

PDF, 2.68 MB

english, 2019

9

Thermal property measurement of thin aluminum oxide layers for giant magnetoresistive (GMR) head applications

Bahareh Behkam, Yizhang Yang, Mehdi Asheghi

Journal:

International Journal of Heat and Mass Transfer

Year:

2005

Language:

english

File:

PDF, 515 KB

english, 2005

10

Thermoelectric Characterization and Power Generation Using a Silicon-on-Insulator Substrate

Jaeho Lee, SangBum Kim, Marconnet, A., in 't Zandt, M.A.A., Asheghi, M., Wong, H.-S.P., Goodson, K.E.

Journal:

Journal of Microelectromechanical Systems

Year:

2012

Language:

english

File:

PDF, 397 KB

english, 2012

11

IC thermal simulation and modeling via efficient multigrid-based approaches

Peng Li, Pileggi, L.T., Asheghi, M., Chandra, R.

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2006

Language:

english

File:

PDF, 947 KB

english, 2006

12

Improved Thermal Interfaces of GaN–Diamond Composite Substrates for HEMT Applications

Cho, Jungwan, Li, Zijian, Bozorg-Grayeli, Elah, Kodama, Takashi, Francis, Daniel, Ejeckam, Felix, Faili, Firooz, Asheghi, Mehdi, Goodson, Kenneth E.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 1.05 MB

english, 2013

13

Phononâboundary scattering in ultrathin single-crystal silicon layers

Liu, W., Asheghi, M.

Journal:

Applied Physics Letters

Year:

2004

Language:

english

File:

PDF, 436 KB

english, 2004

14

Heat Sinks With Enhanced Heat Transfer Capability for Electronic Cooling Applications

Small, Evan, Sadeghipour, Sadegh M., Asheghi, Mehdi

Journal:

Journal of Electronic Packaging

Year:

2006

Language:

english

File:

PDF, 837 KB

english, 2006

15

Measurements and modeling of two-phase flow in microchannels with nearly constant heat flux boundary conditions

Lian Zhang,, Jae-Mo Koo,, Linan Jiang,, Asheghi, M., Goodson, K.E., Santiago, J.G., Kenny, T.W.

Journal:

Journal of Microelectromechanical Systems

Year:

2002

Language:

english

File:

PDF, 166 KB

english, 2002

16

Thermal Boundary Resistance Measurements for Phase-Change Memory Devices

Reifenberg, J.P., Kuo-Wei Chang,, Panzer, M.A., Sangbum Kim,, Rowlette, J.A., Asheghi, M., Wong, H.-S.P., Goodson, K.E.

Journal:

IEEE Electron Device Letters

Year:

2010

Language:

english

File:

PDF, 249 KB

english, 2010

17

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Phase-separation of wetting fluids using nanoporous alumina membranes and micro-glass capillaries

Agonafer, Damena D., Lopez, Ken, Yoonjin Won,, Palko, James, Asheghi, Mehdi, Santiago, Juan G., Goodson, Kenneth E.

Year:

2014

Language:

english

File:

PDF, 4.28 MB

english, 2014

18

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Thermal conduction normal to thin silicon nitride films on diamond and GaN

Cho, Jungwan, Chu, Kenneth K., Chao, Pane C., McGray, Craig, Asheghi, Mehdi, Goodson, Kenneth E.

Year:

2014

Language:

english

File:

PDF, 498 KB

english, 2014

19

Nanoscale Calorimetry Using a Suspended Bridge Configuration

Zhang, Shu, Rabin, Yoed, Yang, Yizhang, Asheghi, Mehdi

Journal:

Journal of Microelectromechanical Systems

Year:

2007

Language:

english

File:

PDF, 908 KB

english, 2007

20

Ballistic phonon transport and self-heating effects in strained-silicon transistors

Etessam-Yazdani, K., Yizhang Yang,, Asheghi, M.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2006

Language:

english

File:

PDF, 1.06 MB

english, 2006

21

Investigation of the Impact of Power Granularity on Chip Thermal Modeling Using White Noise Analysis

Etessam-Yazdani, K., Asheghi, M., Hamann, H.F.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2008

Language:

english

File:

PDF, 704 KB

english, 2008

22

Phonon-boundary scattering in thin silicon layers

Asheghi, M., Leung, Y. K., Wong, S. S., Goodson, K. E.

Journal:

Applied Physics Letters

Year:

1997

Language:

english

File:

PDF, 294 KB

english, 1997

23

Measurement of the thermal conductivity anisotropy in polyimide films

Kurabayashi, K., Asheghi, M., Touzelbaev, M., Goodson, K.E.

Journal:

Journal of Microelectromechanical Systems

Year:

1999

Language:

english

File:

PDF, 447 KB

english, 1999

24

Reactive Metal Bonding of Carbon Nanotube Arrays for Thermal Interface Applications

Barako, Michael T., Gao, Yuan, Won, Yoonjin, Marconnet, Amy M., Asheghi, Mehdi, Goodson, Kenneth E.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 1.45 MB

english, 2014

25

A new chaos agent based approach in prediction of the road accidents with hybrid of PSO optimization and chaos optimization algorithms: a case study

Gharehchopogh, Farhad Soleimanian, Dizaji, Zahra Asheghi

Journal:

International Journal of Academic Research

Year:

2014

Language:

english

File:

PDF, 639 KB

english, 2014

26

Thermal conduction in ultrathin pure and doped single-crystal silicon layers at high temperatures

W. Liu, M. Asheghi

Year:

2005

Language:

english

File:

PDF, 773 KB

english, 2005

27

Power density optimization for micro thermoelectric generators

Dunham, Marc T., Barako, Michael T., LeBlanc, Saniya, Asheghi, Mehdi, Chen, Baoxing, Goodson, Kenneth E.

Journal:

Year:

2015

Language:

english

File:

PDF, 2.15 MB

english, 2015

28

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Numerical Modeling of Heat Transfer and Phase Transition in Programming the Ovonic Unified Memory Cells

Small, Evan, Sadeghipour, Sadegh M., Asheghi, Mehdi

Year:

2005

Language:

english

File:

PDF, 357 KB

english, 2005

29

[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 1 - Investigation of the Accuracy and Spatial Resolution of Scanning Thermal Microscopy (SThM) Technique

Lo, Hsinyi, Liu, Wenjun, Asheghi, Mehdi

Year:

2005

Language:

english

File:

PDF, 373 KB

english, 2005

30

On the Distribution of Limit Cycles in a Liénard System with a Nilpotent Center and a Nilpotent Saddle

Asheghi, R., Bakhshalizadeh, A.

Journal:

International Journal of Bifurcation and Chaos

Year:

2016

Language:

english

File:

PDF, 1.77 MB

english, 2016

31

The Chebyshev’s property of certain hyperelliptic integrals of the first kind

Asheghi, R., Bakhshalizadeh, A.

Journal:

Chaos, Solitons & Fractals

Year:

2015

Language:

english

File:

PDF, 967 KB

english, 2015

32

[Society of Petroleum Engineers Trinidad and Tobago Energy Resources Conference - (2010.06.27-2010.06.30)] Proceedings of Trinidad and Tobago Energy Resources Conference - Integtated Uncertainty Quantification by Probabilistic Forecasting Approach in the Field Development Project

sajjadian, saeed, Asheghi Hossein, Ahmad, Roostaeian, Mohammad, Ghafoori, Mohammadreza, Sajjadian, Valiahmad, Hashemi, Abolfazl

Year:

2010

Language:

english

File:

PDF, 342 KB

english, 2010

33

Fabrication and Characterization of Bi2Te3-Based Chip-Scale Thermoelectric Energy Harvesting Devices

Cornett, Jane, Chen, Baoxing, Haidar, Samer, Berney, Helen, McGuinness, Pat, Lane, Bill, Gao, Yuan, He, Yifan, Sun, Nian, Dunham, Marc, Asheghi, Mehdi, Goodson, Ken, Yuan, Yi, Najafi, Khalil

Journal:

Journal of Electronic Materials

Year:

2017

Language:

english

File:

PDF, 1.11 MB

english, 2017

34

Enhanced phonon scattering by nanovoids in high thermoelectric power factor polysilicon thin films

Dunham, Marc T., Lorenzi, Bruno, Andrews, Sean C., Sood, Aditya, Asheghi, Mehdi, Narducci, Dario, Goodson, Kenneth E.

Journal:

Applied Physics Letters

Year:

2016

Language:

english

File:

PDF, 545 KB

english, 2016

35

[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 3 - Numerical Simulation of Mark Formation/Erasure in Phase Change Recording

Small, Evan, Reifenberg, John, Yang, Yizhang, Sadeghipour, Sadegh M., Asheghi, Mehdi

Year:

2005

Language:

english

File:

PDF, 463 KB

english, 2005

36

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - A Novel Scheme in Thermal Modeling of Printed Circuit Boards

Liu, Wenjun, Lee, Min-Young, Shabany, Younes, Asheghi, Mehdi

Year:

2005

Language:

english

File:

PDF, 661 KB

english, 2005

37

Special Section on InterPACK 2015

Chaparala, Satish, Gupta, Ashish, Asheghi, Mehdi, Suhling, Jeffrey, Ikeda, Toru, Luo, Xiaobing

Journal:

Journal of Electronic Packaging

Year:

2016

Language:

english

File:

PDF, 79 KB

english, 2016

38

Zeros of hyperelliptic integrals of the first kind for special hyperelliptic Hamiltonians of degree 7

Bakhshalizadeh, A., Asheghi, R., Hoseyni, R.

Journal:

Chaos, Solitons & Fractals

Year:

2017

Language:

english

File:

PDF, 1.99 MB

english, 2017

39

Rapid Thermal Characterization of the High Thermal Conductivity Film Layers by the Film-on Substrate Technique

Sadeghipour, Sadegh M., Asheghi, Mehdi

Journal:

Journal of Electronic Packaging

Year:

2006

Language:

english

File:

PDF, 425 KB

english, 2006

40

On the Number of Limit Cycles Bifurcated from a Near-Hamiltonian System with a Double Homoclinic Loop of Cuspidal Type Surrounded by a Heteroclinic Loop

Moghimi, Pegah, Asheghi, Rasoul, Kazemi, Rasool

Journal:

International Journal of Bifurcation and Chaos

Year:

2018

Language:

english

File:

PDF, 430 KB

english, 2018

41

Experimental investigation of embedded micro-pin-fins for single-phase heat transfer and pressure drop

Kharangate, Chirag, Jung, Ki Wook, Jung, SangWoo, Kong, Daeyoung, Schaadt, Joseph, Iyengar, Madhusudan, Malone, Christopher G., Lee, Hyoungsoon, Asheghi, Dr. Mehdi, Goodson, Kenneth

Journal:

Journal of Electronic Packaging

Year:

2018

Language:

english

File:

PDF, 5.68 MB

english, 2018

42

[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 4 - Self-Heating Modeling of Magnetic Recording Read Head

Yang, Y., Baril, L., Schreck, E., Wallash, A., Asheghi, M.

Year:

2005

Language:

english

File:

PDF, 278 KB

english, 2005

43

[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 4 - Thermal Conduction in Ultra-Thin Pure and Doped Single Crystal Silicon Layers at High Temperatures

Liu, Wenjun, Asheghi, Mehdi

Year:

2005

Language:

english

File:

PDF, 401 KB

english, 2005

44

[ASME ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems - San Francisco, California, USA (July 17–22, 2005)] Heat Transfer: Volume 4 - Thermal Characterization of Dielectric and Phase Change Materials for the Optical Recording Applications

Yang, Y., Li, Chun-Teh, Sadeghipour, S. M., Asheghi, M., Dieker, H., Wuttig, M.

Year:

2005

Language:

english

File:

PDF, 769 KB

english, 2005

45

[IEEE 2018 IEEE Applied Power Electronics Conference and Exposition (APEC) - San Antonio, TX, USA (2018.3.4-2018.3.8)] 2018 IEEE Applied Power Electronics Conference and Exposition (APEC) - Modular heat sink for chip-scale GaN transistors in multilevel converters

Pallo, Nathan, Kharangate, Chirag, Modeer, Tomas, Schaadt, Joseph, Asheghi, Mehdi, Goodson, Kenneth, Pilawa-Podgurski, Robert

Year:

2018

Language:

english

File:

PDF, 2.21 MB

english, 2018

46

Impact of thermally dead volume on phonon conduction along silicon nanoladders

Park, Woosung, Sohn, Joon, Romano, Giuseppe, Kodama, Takashi, Sood, Aditya, Katz, Joseph S., Kim, Brian S. Y., So, Hongyun, Ahn, Ethan C., Asheghi, Mehdi, Kolpak, Alexie M., Goodson, Kenneth E.

Journal:

Year:

2018

Language:

english

File:

PDF, 1.19 MB

english, 2018

47

[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - The Heat Conduction Renaissance

Sood, Aditya, Pop, Eric, Asheghi, Mehdi, Goodson, Kenneth E.

Year:

2018

Language:

english

File:

PDF, 112 KB

english, 2018

48

[IEEE 2018 IEEE Symposium on VLSI Technology - Honolulu, HI (2018.6.18-2018.6.22)] 2018 IEEE Symposium on VLSI Technology - Thermal Management Research – from Power Electronics to Portables

Jung, Ki Wook, Zhang, Chi, Liu, Tanya, Asheghi, Mehdi, Goodson, Kenneth E.

Year:

2018

Language:

english

File:

PDF, 2.79 MB

english, 2018

49

Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa

Kong, Daeyoung, Jung, Ki Wook, Jung, Sangwoo, Jung, Daewoong, Schaadt, Joseph, Iyengar, Madhusudan, Malone, Chris, Kharangate, Chirag R., Asheghi, Mehdi, Goodson, Kenneth E., Lee, Hyoungsoon

Journal:

International Journal of Heat and Mass Transfer

Year:

2019

Language:

english

File:

PDF, 2.11 MB

english, 2019

50

[IEEE 2019 IEEE Applied Power Electronics Conference and Exposition (APEC) - Anaheim, CA, USA (2019.3.17-2019.3.21)] 2019 IEEE Applied Power Electronics Conference and Exposition (APEC) - A Compact 50-kW Traction Inverter Design Using Off-the-Shelf Components

Alizadeh, Rana, Adamson, Tyler, Balda, Juan Carlos, Zhao, Yue, Asheghi, Mehdi, Goodson, Kenneth E.

Year:

2019

Language:

english

File:

PDF, 2.72 MB

english, 2019